Oven Reflow Best Practices

October 14, 2021 | Categories: Insights, News

Memory devices become increasingly susceptible to reflow-induced memory loss as process geometries shrink and reflow temperatures increase.  Data I/O previously established that programming was safe with MLC devices. Does that change with automated grade TLC?

  • As vendors move from MLC to TLC devices, will there still be an acceptable margin through reflow?
  • Is there an impact on cell lifetime if devices are pre-programmed?
  • What are the best practices for the newest generation of devices?


To better understand the thermal impact of oven reflow on automotive-grade 3D UFS, Data I/O partnered with a leading UFS memory vendor to study the impact.

The experiment showed :

-reflow slows down read performance but does not cause reliability failures

-More reflows cause read performance to slow down but do not cause loss of data.

              Up to 3 reflows possible

              Refreshing the device after reflow fixes read performance issues completely.

Oven reflow test was performed using automotive-grade 3D TLC UFS devices from multiple semiconductor vendors. Our study found that pre-programming is safe and full device performance is maintained with a post reflow data refresh. Data I/O has published a set of recommended best practices and guidelines for oven reflow


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